- When?
- October 11, 2018 4:00 PM
What?
Join a case afternoon led by ASML, and eat some pizza afterwards.
Manufacturing 3D NAND requires very high aspect ratio etching and, as a result, needs a hard-mask to allow for this. These hard-masks provide an added challenge for wafer alignment in x-y position due to the fact that they are opaque. The wafer alignment in ASML’s machines is currently done optically to nm accuracy. The challenge is; how do we align the wafer to the required nm accuracy through an opaque layer?
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